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INTEGRATED CIRCUITS
DATA SHEET
TDA7050 Low voltage mono/stereo power amplifier
Product specification File under Integrated Circuits, IC01 June 1989
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
GENERAL DESCRIPTION
TDA7050
The TDA7050 is a low voltage audio amplifier for small radios with headphones (such as watch, pen and pocket radios) in mono (bridge-tied load) or stereo applications. Features * Limited to battery supply application only (typ. 3 and 4 V) * Operates with supply voltage down to 1,6 V * No external components required * Very low quiescent current * Fixed integrated gain of 26 dB, floating differential input * Flexibility in use - mono BTL as well as stereo * Small dimension of encapsulation (see package design example) QUICK REFERENCE DATA Supply voltage range Total quiescent current (at VP = 3 V) Bridge tied load application (BTL) Output power at RL = 32 VP = 3 V; dtot = 10% D.C. output offset voltage between the outputs Noise output voltage (r.m.s. value) at f = 1 kHz; RS = 5 k Stereo application Output power at RL = 32 dtot = 10%; VP = 3 V dtot = 10%; VP = 4,5 V Channel separation at RS = 0 ; f = 1 kHz Noise output voltage (r.m.s. value) at f = 1 kHz; RS = 5 k PACKAGE OUTLINE 8-lead DIL; plastic (SOT97); SOT97-1; 1996 July 23. Vno(rms) typ. 100 V Po Po typ. typ. typ. 35 mW 75 mW 40 dB Vno(rms) typ. 140 V Po |V| typ. max. 140 mW 70 mV VP Itot 1,6 to 6,0 V typ. 3,2 mA
June 1989
2
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage Peak output current Total power dissipation Storage temperature range Crystal temperature A.C. and d.c. short-circuit duration at VP = 3,0 V (during mishandling) tsc max. VP IOM Tstg Tc max. max.
TDA7050
6V 150 mA
see derating curve Fig.1 -55 to + 150 C max. 100 C 5s
Fig.1 Power derating curve.
THERMAL RESISTANCE From junction to ambient Rthj-a = 110 K/W
June 1989
3
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
CHARACTERISTICS VP = 3 V; f = 1 kHz; RL = 32 ; Tamb = 25 C; unless otherwise specified PARAMETER Supply Supply voltage Total quiescent current Bridge-tied load application (BTL); see Fig.4 Output power; note 1 VP = 3,0 V; dtot = 10% VP = 4,5 V; dtot = 10% (RL = 64 ) Voltage gain Noise output voltage (r.m.s. value) RS = 5 k; f = 1 kHz RS = 0 ; f = 500 kHz; B = 5 kHz D.C. output offset voltage (at RS = 5 k) Input impedance (at RS = ) Input bias current Stereo application; see Fig.5 Output power; note 1 VP = 3,0 V; dtot = 10% VP = 4,5 V; dtot = 10% Voltage gain Noise output voltage (r.m.s. value) RS = 5 k; f = 1 kHz RS = 0 ; f = 500 kHz; B = 5 kHz Channel separation RS = 0 ; f = 1 kHz Input impedance (at RS = ) Input bias current Note |Zi| Ii 30 2 - 40 - 20 - - - Vno(rms) Vno(rms) - - 100 tbf - - Po Po Gv - - 24.5 35 75 26 - - Vno(rms) Vno(rms) |V| |Zi| Ii - - - 1 - 140 tbf - - 40 - - 70 - - Po Po Gv - - - 140 150 32 - - - VP Itot 1,6 - - 3,2 6,0 4 SYMBOL MIN. TYP.
TDA7050
MAX.
UNIT
V mA
mW mW dB V V mV M nA
mW mW dB V V dB M nA
27.5
1. Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2 (BTL application) and Fig.3 (stereo application).
June 1989
4
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
Fig.2
Output power across the load impedance (RL) as a function of supply voltage (VP) in BTL application. Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25 C.
Fig.3
Output power across the load impedance (RL) as a function of supply voltage (VP) in stereo application. Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25 C.
June 1989
5
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
APPLICATION INFORMATION
TDA7050
Fig.4 Application diagram (BTL); also used as test circuit.
Fig.5 Application diagram (stereo); also used as test circuit.
June 1989
6
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA7050
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
June 1989
7
Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA7050
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
June 1989
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